With cooling capability up to 1000w/cm2, Celsia’s custom heat sink designs can be used to effectively spread and remove heat from high performance electronics. With unmatched design flexibility thermal solutions can be as simple as laser diode heat spreaders to complex assemblies for very high performance systems.

Our application design team has solved high power thermal challenges in the following areas: bare die computational ASICs, ultra high brightness LEDs for medical & UV uses, laser diodes, and automotive power electronics.

Celsia solutions are designed to work under high localized thermal loads using unique evaporator systems to reduce thermal resistance. These evaporator designs can compete with pumped liquid systems for localized cooling of high power devices. Celsia personnel have worked on record setting designs achieving unprecedented performance in passive thermal systems.

Contact us today with your heat sink design challenge.