Heat-Sinks-Space-Constrained

Ever increasing processing power combined with the trend towards smaller enclosures is pushing the envelope of thermal module / heatsink technology – usually at aggressive price points. Celsia has worked with some of the premier companies in the word to design and deliver solutions to meet these difficult challenges.

Heat pipes, hybrid designs and Celsia’s proprietary low cost vapor chamber designs have shipped in millions of products ranging from graphics cards and telecommunication base stations to notebook PCs and decorative LED lighting.

One piece vapor chambers can be as thin as 1mm, allow for post- production bending and can be used by themselves or in combination with heat pipes to move heat to a remote location.

Contact us today with your heat sink design challenge.