Have questions? Solving difficult thermal challenges is what we do.
A thermal interface material (TIM) is the layer placed between a heat-generating component and the heat sink it sits against. In two-phase cooling assemblies, that means between the device
How Two-Phase Devices Reduce Spreading Resistance Before Heat Reaches the Coolant Liquid cold plates are widely used in electronic cooling systems because they remove far
What’s the Difference, and When is Passive Two-Phase the Right Fit? Thermal management discussions about passive and active cooling tend to focus on total heat
Different heat pipe heat sink design can have very different performance and cost implications. Here we compare 1) heat pipes embedded in either aluminum or copper, 2) heat pipes making direct contact with the heat source, and both standard and 3D vapor chambers.
In the battle of two-phase devices, vapor chamber vs heat pipe, there’s no clear winner. Each has attributes that make one superior to the other. This article covers differences in two-phase devices and usage rules of thumb.
This article compares heat sink design options, including solid metal bases, embedded heat pipes, and vapor chambers. It provides engineers with insights into thermal performance, weight, and cost trade-offs to aid in selecting the optimal heat sink configuration for electronic applications.
This article provides an overview of different heat sink types, including passive, active, two-phase, and manufacturing variations. It serves as a resource for engineers seeking to understand and select appropriate heat sink solutions for effective thermal management in electronic applications.
This article offers detailed instructions for utilizing Celsia’s heat sink thermal resistance calculator. It guides engineers through inputting power, material, and airflow parameters to estimate temperature rise and compare thermal resistance between solid metal and vapor chamber base designs.
Instruction page for Celsia’s Heat Sink Size Calculator.
