Concentrated power at the die or source exceeds what a metal base can spread on its own.
Heat crowds at the source faster than it conducts outward, driving up junction temperatures.
Tight enclosures, awkward source-to-sink paths, and SWaP limits leave no room for a conventional sink.
Shock, vibration, altitude, and thermal cycling demand designs validated for the field, not the bench.
Vapor chambers and integrated spreaders pull heat off concentrated sources across a wide, isothermal base.
Heat pipes and thermosiphons move heat across distance and orientation to where it can be rejected efficiently.
Optimized fin stacks and heat-sink geometries dump heat into air or liquid within your airflow budget.
Learn more about system-level thermal design
Application-tuned wall thickness, wick thickness, porosity, permeability, and fluid loading.
Lower-cost devices allow Z-axis bending in dimensions up to 109mm wide and 5mm thick.
Stamped into any shape along the XY axes, with options for embossments, through-holes, and variable wicks.
Machined vapor chambers attach to multiple heat sources, while methanol heat pipes extend the range.
Manages substantial transient spikes to ambient temperature or device thermal load.
Resolves excessive shock, vibration, or thermal expansion issues between the heat source and condenser.
A primer on evaporation, capillary action, and condensation — and when two-phase beats solid conduction.
Cost-effective design for natural convection applications.
High fin density for controlled airflow environments.
Offers the most design flexibility for low-volume production.
High heat flux capability with high aspect ratio possibilities.
Provided with attached fins, TIM, and mounting hardware.
Designs using 3D vapor chambers or square heat pipes.
Ground, airborne, and naval systems where ruggedization and survivability are non-negotiable.
Avionics and payloads where mass, altitude, and low airflow drive every thermal decision.
High-density, continuous-duty equipment in outdoor cabinets and dense data-plane hardware.
Wherever heat flux, density, or reliability outruns conventional cooling.
Rapid modeling validates feasibility — sizing, ΔT budgets, and orientation sensitivity worked out before any hardware is cut.
Correlate models to physical performance — balancing SWaP-C across thermal, mechanical, and environmental envelopes.
Controlled transition from prototype to full scale — material traceability and 100% testing on every two-phase device.
U.S. Corporation
Two-phase technology
8-year customer average
Models and footprints to drop into your design.
Qmax, ΔT, and first-pass thermal sizing.
Worked application notes and deeper two-phase research.
From wick selection to vapor chamber stamping.
